Used IPEC / WESTECH / SPEEDFAM 676 #105137 for sale

IPEC / WESTECH / SPEEDFAM 676 Wafer Grinding, Lapping & Polishing equipment is a machine for precise and efficient thinning, planarization and wafer polishing. This machine is generally used for thinning and planarization of silicon, II-VI, and III-V wafers ranging from 2" to 8" in diameter. It is capable of processing low-k, glass, polymers, ceramic, and compound materials. The system consists of an adjustable abrasive grinding belt and stationary diamond cup wheels. This configuration allows for selective single-side thinning as well as double-side thinning. The unit has overload protection sensors, real-time video imaging, and a loop control machine. This provides better die flatness, improved uniformity, and maximized throughput. In addition, IPEC 676 has a three-stage adhesive lapping tool that utilizes a pneumatically controlled lapping material. This stage can be used to refine the surface roughness of the wafer. The machine features a variable speed polishing head that has variable speed control. It also has a variable lapping platen, variable polishing pressure and variable loading/unloading positions. This allows for flexibility during wafer processing. WESTECH 676 also contains a computerized control asset with user friendly controls. This allows the operator to easily program, adjust and monitor the tool for quality and productivity optimization. Lastly, this model is equipped with a full range of supplementary components, such as pumps, back-up tanks, spinning filters, and cooling systems for efficient operation for any type of wafer material. 676 is an ideal solution for wafer grinding, lapping and polishing. This precision equipment is designed to provide repeatable, efficient and high-quality results. It is capable of producing uniform surfaces on a variety of wafer materials, and it is an excellent choice for improving throughput, quality and the yield of wafer production.