Used IPEC / WESTECH / SPEEDFAM 676 #8353 for sale

IPEC / WESTECH / SPEEDFAM 676 wafer grinding, lapping & polishing equipment is designed for efficient, effective, and precise preparation of wafers for use in the semiconductor industry. This system is composed of an integrated grinding/polishing table, grinding/polishing head, adjustable table covers, slurry and lubricant delivery, and filtration systems. The table and grinding head consist of a rigid and adjustable platform, allowing for a consistent material removal control across various angles, thicknesses, and shapes. The adjustable table covers provide protection to the grinding head and working table, while retaining the temperature within a consistent range and minimizing the possibility of oxidation or contamination. The table cover also acts as a dust cover, preventing particulate material from entering the grinding/polishing area. The slurry and lubricant delivery is designed to optimize the amount of material applied to the wafer, and the filtration systems keep damage from particles to a minimum and ensure that only the most finely polished surface is achieved. The unit utilizes both a chemical/mechanical process and a planar, directional grinding/polishing operation that allows for a consistent material removal rate, across substrates and applications. IPEC 676 wafer grinding, lapping & polishing machine is designed for a high level of automation, and is equipped with programmable parameters and settings to ensure precision and accuracy of the grinding/polishing operations. The tool has a user-friendly interface with safety settings and failsafe features to ensure a safe and productive operation every time. A wide range of grinding and polishing compounds are also available to give the best results, depending on the type of material being machined. WESTECH 676 wafer grinding, lapping & polishing asset is able to handle both large and small wafers, and provides a consistent, high quality finish. This model is the perfect choice for anyone needing to achieve a highly precise finish and smoothness on a variety of wafer materials. With its efficient and reliable performance, the equipment ensures a perfect finish every time, making it an essential tool for any wafer production application.