Used IPEC / WESTECH / SPEEDFAM Auriga #141543 for sale
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ID: 141543
CMP system
Specifications:
2-Table, 5-carrier platform
Precision automation
Upgradable with advanced carrier technology for 3mm edge exclusion
Dry-in, wet-out format provides maximum tool flexibility
ViPRR multizone carrier.
IPEC / WESTECH / SPEEDFAM Auriga is a wafer grinding, lapping and polishing equipment designed for precision grinding and polishing applications as part of the semiconductor, MEMS and optoelectronic industry. Its main purpose is to improve surfaces and geometries of components for a variety of different applications. IPEC Auriga utilizes a dual-spin lapping/polishing process, employing two separate grinding heads for simultaneous grinding and polishing for increased throughput and ease of operation. Each grinding head features a wafer chuck and jig which can be preset for specific diameters and pitches and is designed for quick and precise grinding and polishing. An automatic dispense system and two-axis, four-speed stage drive are integrated into the unit. WESTECH Auriga is equipped with an automated, multi-axis motion control machine, incorporating both linear and 3D/rotary scans, that provides precise control over the grinding and polishing processes and makes it capable of producing high-precision, low-cost optical and surface regularity parts. The patented 3-D scan tool incorporates a high-resolution position encoder and control software to ensure repeatable, precise and controlled results. In addition, Auriga asset is equipped with a closed-loop pressure, lubricant and fluid temperature control model that is designed to provide consistent, accurate, repeatable and reliable results from part to part. The equipment also offers real-time feedback of the grinding and polishing pressure, as well as monitoring of any potential coil or chuck damage. A comprehensive safety system is also included for operator and equipment protection. SPEEDFAM Auriga unit is designed for high precision grinding and polishing operations, and has been shown to be more accurate and consistent than other methods on a range of materials, including ceramics, sapphire, composite materials, rubbers and plastics. Its use in the semiconductor, MEMS and optics industries is a testament to its capability and reliability.
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