Used IPEC / WESTECH / SPEEDFAM Avantgaard 676 #9092866 for sale
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ID: 9092866
Wafer Size: 8"
Vintage: 1996
CMP system, 8"
Used for Tungsten Polish
676 Mainframe with Operator Interface Monitor
System Computers: (1) SysCon, (4) Polish Heads, (1) Endpoint, (1) C2C
ystem Software: Advantgaard 676 3.0 rev S S
Brookside Endpoint Detection System with Configurable Algorithm to Detect Endpoint
(4) Mechanical polishing heads with Advanced Pad Motion
(3) Systolic Pumps for Slurry or DI Water
High Flow DI Water Rinse Valve Configuration
Upper and Lower Pneumatics Panel
Hoist for Upper Motor and Tower Removal
(2) Pad Conditioning Systems
Cassette to Cassette Wafer Handling System
Genmark Gencobot Multi-Axis Robot with Wafer Pickup Paddle
Wet Cassette Assembly with Wafer Sensor Array
Spray Box Assembly
Electrical Cabinet with Computer Control Station
1996 vintage.
IPEC / WESTECH / SPEEDFAM Avantgaard 676 wafer grinding, lapping, and polishing equipment is a comprehensive platform for manufacturing the components of integrated circuits (ICs). This state-of-the-art system is equipped with the latest automation technologies to provide a high level of accuracy and throughput. The machine utilizes a combination of grinding, lapping, and polishing techniques to achieve a smooth, flat surface with minimal defects. IPEC Avantgaard 676 includes a precision grinder with a diamond coated grinding wheel. Through the grinding process, particles of diamond are worn away to obtain the desired surface roughness. In order to further refine the surface, the lapping process is used. This involves utilizing a rotating abrasive material of a specific size distribution, in order to remove any remaining imperfections. Additionally, the unit features a fine polisher, which uses a similarly rotating abrasive material, to restore and enhance the fine surface finish. The machine is built to be user-friendly, with a flexible tool handling machine and a self-centering spindle. Additionally, the tool boasts a high performance robotic arm that can be programmed to multiple functions, including loading and unloading of wafers from the tooling, and making adjustments to the grinding, lapping, and polishing processes. The asset further features a broad range of measures for monitoring and evaluating the process. These include an advanced process monitoring module, providing real-time monitoring of the process parameters such as spindle speed and pressure. Additionally, the model includes a detailed data logging equipment to provide statistical analysis of the process. Finally, WESTECH Avantgaard 676 is equipped with the latest safety features, including a robust interlock system that ensures the platform is completely shut down in case of any anomalies or malfunctions. The machine is also constructed according to the safety regulations of the International Electrotechnical Commission (IEC). All in all, Avantgaard 676 is a powerful and reliable wafer grinding, lapping, and polishing unit, designed to meet the exacting requirements of the semiconductor industry. Its user-friendly design, wide range of features, and advanced safety features make this an ideal platform for high precision IC production.
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