Used IPEC / WESTECH / SPEEDFAM Avanti 372M #9092868 for sale

IPEC / WESTECH / SPEEDFAM Avanti 372M is a precision wafer grinding, lapping and polishing equipment designed for the most demanding applications in the semiconductor industry. This versatile system can be used to process a variety of materials, including crystalline materials such as silicon, sapphire, quartz, and gallium arsenide. The unit is equipped with a number of advanced features and capabilities. Its closed loop process control machine allows for accurate elimination of both systematic and random errors, resulting in a more precise finish. The tool is equipped with a 6 micron instantaneous positioning asset to ensure precise wafer positioning. IPEC Avanti 372M is designed to accommodate wafer sizes up to 8" in diameter and up to 1.2mm thick. It has a polishing head that uses up to 5 abrasive pads, and it features a high throughput, 4-pad lapping head with a throughput of up to 9um/hr. The model is capable of controlling the pressure from 0,5N to 800N. It also features a number of profiling options, such as radial profiling, center profiling, circumference profiling, and flatness profiling. The equipment's unique feature is its micro-step technique. This enables extremely accurate spacing between the abrasive pads and the wafers, resulting in uniform finish. This feature also ensures that the wafers are not damaged due to unevenly applied pressure. WESTECH Avanti 372M is a reliable and efficient system, and it is easy to install and operate. It is designed to reduce wafer-manufacturing costs through its utilization of metal-diamond abrasives. The unit also features a CCD monitor and print preview for image review. Overall, SPEEDFAM Avanti 372M is an advanced wafer grinding, lapping and polishing machine that can handle a variety of materials, including crystalline materials. It is an efficient and reliable tool that is easy to operate and can provide an extremely precise finish. It is capable of controlling pressure from 0.5N to 800N and is equipped with sophisticated profiling options. In addition, its micro-step technique ensures that wafers are not damaged by unevenly applied pressure.