Used IPEC / WESTECH / SPEEDFAM Avanti 472 #293828724 for sale

IPEC / WESTECH / SPEEDFAM Avanti 472 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed for high-precision and high-quality processing of semiconductor wafers and other substrates. With advanced motion control and back-reflection-free optics, IPEC Avanti 472 offers fast, reliable production of thin wafers and flat surfaces with no edge rounding or surface disruption. WESTECH Avanti 472's advanced grinding stage boasts a variety of abrasive technology and helps to reduce process times. The machine utilizes a fixed slip table, which is equipped with precision cross-sliders to handle two wafers of different sizes, enabling superior micron-level accuracy. The machine's unique approach to polishing allows multiple facets of a wafer to be ground in a single pass, drastically reducing process times and improving cycle times. It also features intelligent tooling, which enables grinding and polishing of many different shapes and sizes on the same work platform. The automated tooling system of SPEEDFAM Avanti 472 is designed to match its advanced motion control and optics. The machine utilizes an advanced unit of wafer holders and handling trays to quickly and precisely load and unload wafers without contamination or damage. In addition, a variety of specialized tooling, including grinders, lapping plates, polishers, and tensioners, are provided to ensure optimal performance. Avanti 472 is designed with an extensive safety machine that ensures operator safety and prevents potential workpiece failure. An air coolant tool with low-temperature, no-contact cooling ensures uniform cooling of the wafer, helping to extend its lifespan and maintain product consistency. A dust collection unit helps to protect the grinding stage components from contamination and debris. Finally, an integrated anti-crash asset prevents collisions of the wafer during processing. With its sophisticated design, IPEC / WESTECH / SPEEDFAM Avanti 472 is an excellent choice for high-precision semiconductor wafer grinding, lapping, and polishing. Its advanced motion control and back-reflection-free optics help reduce cycle times, while its specialized tooling ensures superior micron-level accuracy. In addition, its automated model and integrated safety features provide peace of mind.