Used IPEC / WESTECH / SPEEDFAM Avanti 472 #9188602 for sale

IPEC / WESTECH / SPEEDFAM Avanti 472
ID: 9188602
Wafer Size: 8"
Vintage: 2003
CMP polisher, 8" 2003 vintage.
IPEC / WESTECH / SPEEDFAM Avanti 472 is a precision wafer grinding, lapping and polishing equipment. It is specifically designed to meet the specific demands of production applications, and is capable of producing extremely high quality etched and planarized wafers. IPEC Avanti 472 is equipped with four different lapping operations, providing it with an immense versatility when it comes to various wafer processing needs. An abrasive slurry is circulated through the unit to provide the necessary grinding and polishing action. The abrasive particles vary from 30 microns to 5 microns in size, resulting in a highly accurate and uniform finish on the finished wafers. WESTECH Avanti 472 system is capable of grinding both single and double sided surfaces. As well as wafers, the unit can also be used for grinding, lapping and polishing small components, such as substrates and dies. This versatility ensures maximum efficiency in processing large quantities of wafers. The polishing process is achieved in two stages. Firstly, a silicon oxide suspension is used to provide a more consistent and uniform finish on the wafer. Then, an advanced tungsten carbide or diamond-abrasive suspension is utilised for polishing. This step results in a highly brilliant and defect-free wafer surface. In addition to the polishing process, Avanti 472 can also be used for cleaning, etching, and film deposition. The machine is designed to prevent accidental contamination of adjacent components or wafers by using on-board chemical filtration and chemical mixing systems. SPEEDFAM Avanti 472 can be used alone, or integrated with other production processes, in order to maximise production output. It is capable of processing wafers up to 300mm in size, and is designed to meet the most demanding production requirements. Overall, IPEC / WESTECH / SPEEDFAM Avanti 472 is a highly versatile and reliable tool that provides precision wafer grinding, lapping and polishing. It provides a uniform and defect-free finish to wafers, making it an ideal choice for precision production applications.
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