Used IPEC / WESTECH / SPEEDFAM PLANAR 472 #9144591 for sale

IPEC / WESTECH / SPEEDFAM PLANAR 472 wafer grinding, lapping, and polishing equipment is an industrial-grade equipment platform designed to produce the most precise and uniform surface finishes for both manual and automatic processing of semiconductor-grade single-side, double-side, and ultra-thin wafers. It has a four-axis digital servo drive system which enables extremely precise speed control and ensures extremely uniform surface finishes. IPEC PLANAR 472 includes a three-wheeled surface grinder and an interfacing wafer exchange unit. The three-wheeled grinding tool is adjustable to accommodate necessary angles and vibrational speeds, and is capable of generating the highest quality of roughness on the surface of the wafers. The grinding tool is specifically designed to ensure minimal deformations on the wafer surface while still providing the necessary grit and grinding pressure. For increased precision, the wafer exchange machine uses precise movements to handle the wafer from the grinding station and can move it directly to the exchange table. WESTECH PLANAR 472 is also outfitted with two sets of lapping and polishing wheels for precise and uniform surface polishing. It uses a dual-head diamond lapping and polishing tool that can process two wafers simultaneously. This asset is accurate to within a nanometer for uniform surface polishing. SPEEDFAM PLANAR 472 also has powerful and consistent lapping and polishing speed control able to reach up to 5000 RPM, while generating minimal noise and vibration. In addition, PLANAR 472 has several features to increase user efficiency and safety. It includes a digital automated wafer recognition model, which ensures accuracy when exchanging wafers or loading them onto the grinding and polishing tools. It is outfitted with a programmable heating equipment that helps regulate temperature in a closed environment. IPEC / WESTECH / SPEEDFAM PLANAR 472 also has intuitive graphical user interface (GUI) software that allows the user to easily create, store, and recall digital recipes that are superior to traditional manual processes. IPEC PLANAR 472 wafer grinding, lapping, and polishing system is an advanced device designed to streamline the production process of semiconductor-grade wafers. It is powerful, accurate, and precise and can produce wafers with the highest standard of uniformity and surface finish.