Used JENG YUEH JY-M36 #9364499 for sale

JENG YUEH JY-M36 is a precision wafer grinding, lapping, and polishing equipment made specifically for semiconductor wafers and other defect sensitive substrates. It features a patented diamond grinding wheel, capable of grind depths down to 70nm, and a lapping nip point capable of high accuracy control over surface flatness. The machine is equipped with advanced servo motion controllers to enhance its precision. The motion control system is designed to facilitate the precise control of the samples orientation and movement, as well as of the velocity, acceleration and deceleration of the belts used during the polishing process. MTI also offers an array of unique semi-automated sub-systems for handling, transportation and clamping of the wafers within the machine. JY-M36 Wafer Grinding, Lapping & Polishing Unit features a high degree of automation, allowing for unattended operation. It is capable of grinding and lapping eight wafers simultaneously and up to eight grinding & lapping belts can be used at the same time. The single head lapping section is also capable of producing high-definition finishes that will exceed the demands of today's wafer requirements. It is equipped with an adjustable abrasive velocities and variable oscillation frequency to further refine the various surface finished. Its even finish polishing media provides improved polishing uniformity for high-end products. The machine also provides safety features such as a vacuum control tool to eliminate the risk of fire, and an emergency stop feature to ensure the safety of operators and equipment. An automated cleaning asset is also included to ensure a dust-free environment. JENG YUEH JY-M36 Wafer Grinding, Lapping & Polishing Model is designed for high-volume, high-speed production applications in the semiconductor industry. Its state-of-the-art design, advanced controls, high-precision capability, and flexibility to meet various consumer specifications make it an ideal choice for many industrial purposes.