Used JEOL EM 09100 IS #9380743 for sale

JEOL EM 09100 IS is a multi-functional equipment designed to perform wafer grinding, lapping and polishing operations. This system is housed in a floor-standing cabinet, but can also be integrated with fume hoods or vacuum/gas cabinets provided by the customer. The unit consists of three separate components: grinding, lapping and polishing stages. The grinding stage of the machine is used to provide rough machining of wafer material to prepare it for the polishing process. To accomplish this, the tool utilizes a permanent magnetic chuck table, which is driven by a high-precision stepper motor. The grinding wheel is then placed above the surface of the table, and is driven by a separate, high-torque DC motor. This wheel is made from an aluminum oxide abrasive material to ensure a consistent cut and polish rate. The lapping stage is used to refine the surface of the wafer material after it has been ground. In this process a slurry dispenser is used to wet the surface of the material with a polishing solution, which will act as a lubricant to smoothe and polish the surface. The lapping table consists of a rotating platen, a stationary platen, and two abrasive disks. The wafer material is placed between the rotating and stationary platens, while a slurry solution is dispensed onto the material's surface. This process of lapping helps to reduce the remaining asperities on the surface of the wafer material, making it smoother and more consistent. The polishing stage is the final step in the asset's wafer machining process and is used to produce surfaces with micro-scale finishing. In this process, a diamond-coated pad is used to impart a very precise finish on the wafer material. A slurry solution is continually applied to the surface to ensure consistent polishing. The resulting surface is optically flat and is free from scratches or other imperfections. Overall, EM 09100 IS is an advanced model that brings together three stages of wafer machining—grinding, lapping and polishing—in one floor-standing cabinet. In addition to precise material machining, the equipment also offers various additional features such as an automatic slurry dispenser and precise stepper motor control. This system is ideal for achieving repeatable, precise and high-quality results in wafer grinding, lapping and polishing.