Used JEOL IB-09010CP #293766541 for sale

JEOL IB-09010CP is a modern and advanced wafer grinding, lapping and polishing equipment that is suitable for producing precision flat surfaces on wafers. In today's ultrahigh-resolution manufacturing process, the precision of the wafer surface is critical to the quality of the finished product. JEOL IB-09010 CP wafer grinding, lapping and polishing system has been designed to meet the demands of modern and advanced wafer production. The unit is equipped with a low-frequency generator and AC/DC converter for optimal performance in grinding, lapping and polishing operations. A vibration-free stabilizing table ensures a repeatable, stable grinding plane. The machine also features a high-performance turbine with gas ventilation technology for complete grinding requirements. Because of this, IB-09010CP can grind materials of up to 0.5mm in thickness and up to 3mm in diameter. This tool includes a range of grinding and polishing tools such as diamond abrasive discs, CMP pads, felt polishing pads, and even optically flat wafers. Additionally, it allows for the use of different types of Polycrystalline Diamond (PCD) abrasive techniques to achieve the desired effect on the surface. The grinding speed and pressure can be precisely adjusted to bring the face of the wafer to the desired flatness. IB-09010 CP is also capable of polishing single side of the wafer with a special brush set for superior results. JEOL IB-09010CP is well-suited for wafer production processes in a variety of industries, such as semiconductor, optic, and bio-medical. It features an easy-to-use graphical user interface that allows the user to set and control the grinding parameters in a few clicks. The asset also has dust-protected filter technology, which manage the emission of dust and optimizes the working environment. JEOL IB-09010 CP is a reliable and robust wafer grinding, lapping and polishing model that provides superior results in terms of flatness, surface quality and repeatability. It is an ideal equipment for ultrahigh-resolution wafer production processes.