Used JEOL SM-09010 #293638040 for sale

JEOL SM-09010 is a wafer grinding, lapping, and polishing equipment designed to produce smooth, high quality surfaces on wafers. The system utilizes a precision spindle design to provide superior accuracy and surface finish for both grinding and polishing applications. The unit utilizes a motor-driven spindle machine to provide a high degree of control and automation over grinding and polishing processes. The tool is capable of grinding down material layers more than 1 µm thick and can produce an average wafer surface roughness of 0.3 - 0.7µm RMS. The spindle is equipped with a control asset to facilitate precision positioning of the wafer and to optimize the grinding, lapping, and polishing process. The spindle also features a pressure sensor model to ensure the optimal surface finish is achieved. The spindle is powered by a brushless motor which enables quiet operation and superior repeatability and accuracy. The equipment uses two different grinding discs for each process. One for grinding and lapping and the other for polishing. Each disc has been designed to produce a consistent, high surface finish with minimal damage to the underlying substrate. The discs feature a stepped design to enable Uniformity in the grinding and polishing process. The system also includes a vacuum pick-up shuttle for automating the transfer of the wafer before and after the grinding, lapping, and polishing processes. The vacuum shuttle is also capable of picking up a variety of wafer types including round, rectangular, and 'slotted chip form' wafers. The unit is additionally equipped with a liquid cooling machine to prevent the formation of heat-induced defects. Overall, JEOL SM 09010 offers a powerful, reliable, and accurate grinding, lapping, and polishing tool for the production of high quality wafers. With its automated capabilities and high precision spindle it is capable of consistently producing superior surface finishes with minimal damage to the substrate.