Used JEOL SM-09010 #293661426 for sale

JEOL SM-09010 is a wafer grinding, lapping and polishing equipment that is suitable for use in a wide range of industries. It is designed to provide an economical and efficient solution for production-level demands. The system is composed of an upper and lower spindle, both of which use dip plates to hold the wafers in place. The upper spindle can be adjusted to accommodate different workpiece sizes, while the lower one contains a grinding head and a special wafer clamp. This enables the user to change the settings for grinding and lapping of the wafer quickly and without having to remove the wafers from the machine. JEOL SM 09010 is capable of grinding wafers up to 24 inches (610 millimeters) in diameter. The grinding head has a maximum speed of 70,000 rpm and a maximum power rating of 0.75 kW. The machine features variable frequency speed control, adjustable grinding pressure and a height adjustment unit for accommodating different workpiece thicknesses. The machine is equipped with a built-in lapping machine to provide a smooth finish to the wafers. The lapping tool has an adjustable speed range of up to 70,000 rpm and a maximum power rating of 0.75 kWh. The lapping machine is equipped with a dust collection asset to ensure that deburring is kept to a minimum during the lapping process. SM-09010 also includes a polishing model that uses a diamond wheel with a maximum speed of 10,000 rpm. The polishing equipment has adjustable speed settings and can polish up to 70,000 wafers in one hour. The diamond wheel has adjustable pressure settings and is capable of producing smooth, high-quality surfaces on wafers. The machine has a user-friendly graphical interface, which provides clear feedback on the process. The data is displayed on the touch screen and can be easily accessed and monitored during the grinding, lapping and polishing processes. In conclusion, SM 09010 is a reliable and cost-effective wafer grinding, lapping and polishing system that can be used in a wide range of applications. Its efficient and user-friendly design makes it ideal for high-volume wafer processing.