Used JEOL SM-09010 #9055560 for sale

JEOL SM-09010 is an automated wafer grinding, lapping & polishing equipment designed for taking thick film circuits from the cleanroom to the back end packaging assembly process. This system provides high throughput, low particle contamination, and precise thickness and surface planarity control for optimum manufacturing. JEOL SM 09010 includes a wafer chuck for safe and secure substrate handling, and includes a series of lapping and polishing steps to achieve the desired surface finish. The wafer chuck's secure holding and isolation systems enables processing of single or multiple thin or thick substrates. Depending on the configuration chosen, the holding and isolation systems can vary from manual to automated. For multi-chip modules, the chuck provides an optimized clamping pressure that is adjustable to meet the application requirements. SM-09010 includes an integrated diamond grinding wheel for precision grinding throughout the entire wafer rotation. This ensures consistently uniform surface texture. The grinding wheel also ensures low grinding pressure, preventing scratching. The unit is also equipped with a lapping plate that allows for flatness and thickness control during the lapping stage of the process. The lapping plate is made of a proprietary coating that increases efficiency and reduces slippage. The polishing stage is where the machine really shines. It uses an actuator-driven diamond-agglomerated pad to achieve even surface topography levels. The pad is also designed to reduce stress while preventing any burr formation. It is possible to achieve an RMS value of lower than 3nm in this stage. Additionally, the polishing stage of SM 09010 features an inert gas purge, as well as advanced temperature control. This helps ensure consistent results, and reduces the occurrence of dust particles and other contaminants that could prevent cleanliness standards from being met. Finally, JEOL SM-09010 features an information display tool that provide continual real-time feedback on process parameters, results, and other information. The asset can also generate comprehensive reports for each process cycle, enabling in-depth quality data analysis for optimum product purity and performance. Overall, JEOL SM 09010 wafer grinding, lapping, and polishing model is an ideal option for complete and automated substrate processing that meets cleanroom manufacturing standards. With its secure and customizable holding systems, precision grinding and polishing stages, and information display and analysis features, this is the perfect solution for producing high-quality thin-film circuits.