Used JONES & SHIPMAN Edgetek 5-Axis #9163002 for sale

JONES & SHIPMAN Edgetek 5-Axis is a state-of-the-art wafer grinding, lapping and polishing equipment designed to provide the most precise, repeatable and reliable results. The machine is a robust and compact piece of equipment designed to grind, lap, shape and finish silicon wafers in the demanding environment of wafer fabrication. The system is equipped with a 5-axis grinding/lapping/polishing head that is capable of dedicated and simultaneous 5-axis grinding, lapping and polishing operations. The motorized head can be programmed to follow a predetermined path enabling fast and precise control of the rotation speed and direction, spindle speed and direction, X-Y table position and Z-depth. The spindle motor is capable of up to 4,000 rpm and is adjustable to provide for a wide range of grinding, lapping and polishing speeds. The spindle is also compliant with a variety of tools, from cup wheels to diamond lapping films and diamond grinding wheels. The programmable X-Y positioning table supports the mounted components to provide precise movement during operation. A closed-loop linear-motor driven servo unit is configured to yield complete positional control to programmatically polish the sample in three dimensions. The Z-axis of the top plate consists of a servo motor coupled with a bearing-mounted slide providing a rapid, accurate and repeatable movement. The Z-axis also contains a digital electronic read-out and servo control machine which allows for a consistent point-to-point displacement measurement. Edgetek 5-Axis is designed to maximize quality and repeatability while minimizing operator influence and providing excellent homogeneity. The machine is reliable, flexible and cost effective and is ideal for high-volume production runs.