Used JUNG JA 500 CNC-E #9086186 for sale

JUNG JA 500 CNC-E is an advanced wafer grinding, lapping, and polishing equipment designed for precision fabrication of semiconductor wafers. It boasts a full suite of CNC control functions to meet the demands of today's advanced chip manufacturing technology. This automated system can grind and lap wafers up to 500mm in size, and is capable of producing accurate surfaces with sub-micron precision. At the heart of the unit is a compact gantry-mounted grinding and polishing head. This is capable of accurately linearly moving in three axes, allowing it to grind both standard full-size wafers and oversize wafers up to 500 millimeters in length. The head has a dynamic frequency drive controller connected to a servo motor, allowing it to move with high precision. The grinding and polishing head houses up to six different diamond grinding and polishing wheels, each with their own independent motor. This allows eight different processes variables to be controlled during operation, including axes, speed, and load. The machine's control machine is an industrial PC-based controller, with a 17 inch touch screen display. This allows the operator to easily monitor and control processes from tool start-up to complete wafer grinding and polishing. Through this interface, users can select programs for single operations, multiple operations, or custom sequences of up to fifty operations for each wafer, allowing for greater flexibility and automation. The asset also has an independent CNC programmable grinding head, which allows grinding and polishing profiles to be accurately reproduced. JA 500 CNC-E is an essential model for modern semiconductor fabrication. By harnessing the power of CNC technology, it is capable of producing high precision finished wafers consistently and with minimal operator intervention. From full-size wafers up to 500 millimeters in length, JUNG JA 500 CNC-E is the perfect choice for high-quality manufacturing of semiconductor wafers.