Used JUNG JC 500 CNC-A #9066954 for sale

JUNG JC 500 CNC-A is an advanced wafer grinding, lapping, and polishing equipment intended for use in semiconductor fabrication. The system offers a variety of features which make it ideal for a wide range of applications, including wafer thinning, backside grinding, backgrinding, flattening, polishing and finishing of semiconductor wafers. The unit is equipped with a 500 mm diameter chuck and a maximum table height of 250 mm. JC 500 CNC-A is a fully-automated machine that utilizes precise and repeatable movements to create a superior finish on semiconductor wafers. Its highly-efficient and rapid-fire, 6-axis drive machine enables accurate movements on all six axes which are precisely controlled by an onboard numerical control (NC) unit. This NC unit is loaded with several programs containing information about the required machine motions relative to the wafers. As a result, precise and repeatable movements can be automatically performed regardless of the wafer shape, size, or process time. The tool is designed with advanced safety built into every component, resulting in a superior and secure product. JUNG JC 500 CNC-A has a variety of user-friendly functions that provide the user with an intuitive user experience. These features include a weight detection asset to ensure that the correct amount of wafer material is loaded, a dynamic measuring model that monitors and records the positional accuracy and wafer shape, and a safety switch which is triggered when an irregular motion takes place. This minimizes the risk of any potential accidents with the equipment. Furthermore, JC 500 CNC-A is equipped with a high-resolution web camera for online inspections, monitoring, and diagnosis purposes. This camera gives users the ability to quickly scan the wafer for defects and irregularities during operation. This helps ensure that the wafers are processed efficiently and correctly. JUNG JC 500 CNC-A is equipped with a wide range of abrasive materials, allowing a variety of different processes to take place. The system can process up to 100 wafers per hour, making it the ideal choice for any chip fabrication plant. In conclusion, JC 500 CNC-A is an advanced wafer grinding, lapping, and polishing unit which offers a variety of features making it ideal for a variety of processes. Its advanced numerical control machine, enhanced safety features, and intuitive user interface make it the perfect option for chip fabrication plants looking for a reliable and efficient tool to process their semiconductor wafers.