Used KAO-YU PRECISION MACHINERY KYL-9B-5L #9266482 for sale

KAO-YU PRECISION MACHINERY KYL-9B-5L is an automated wafer grinding, lapping, and polishing equipment designed for the production of precision surfaces with the highest possible level of uniformity and repeatability. The system utilizes a combination of abrasive grinding, lapping, and polishing processes to achieve the desired results. The KAO-YU KYL-9B-5L unit is comprised of a modular design that allows for the configuration of vacuum chucks, rotatable grinding heads, and lapping heads for increased production capacity. The machine is further distinguished by its high precision linear and rotary motion capabilities, allowing for reliable and accurate positioning and movement of wafer substrates as required. In addition, KAO-YU PRECISION MACHINERY KYL-9B-5L is equipped with several safety features, such as an array of interlocks and emergency stop circuits, to ensure the safety of operators and compliance with applicable health and safety regulations. The tool is further equipped with a computerized motion control unit (MCU) for advanced control of the grinding and polishing processes. This MCU features advanced motion profile navigation and editing software, enabling intricate motion profiles for final tolerances as low as two-thousandths of an inch (0.002 inches). The KAO-YU KYL-9B-5L utilizes a highly precise, digital pressure regulation asset that allows for fine-tuning of the lapping process. This ensures optimal substrate performance and the consistent removal of stationary stones, grooves, and other anomalies on the wafer surfaces with minimal stress to the wafer substrate. KAO-YU PRECISION MACHINERY KYL-9B-5L model utilizes an integrated optical equipment with optical laser and high-resolution imaging cameras for easy measurement and verification of substrate surface profiles before and after polishing. In addition, the system is also capable of controlling the feed rate automatically when the grinding head is engaged. This ensures the uniformity of the grinding process and removal of any preexisting anomalies on the wafer surface. Overall, KYL-9B-5L is a highly advanced wafer grinding, lapping, and polishing unit capable of delivering precision surfaces with superior repeatability and reliability. Its combination of automated process control, precision mechanical motion control, and optical measurements make KAO-YU PRECISION MACHINERY KYL-9B-5L the ideal machine for a variety of wafer grinding, lapping, and polishing applications.