Used KELLENBERGER 600 U-125 #9217940 for sale

KELLENBERGER 600 U-125 is a highly advanced multi-step equipment for grinding, lapping, and polishing semiconductor wafers. 600 U-125 system offers significant benefits, such as greater precision, increased efficiency, and superior surface smootherness. The unit is equipped with a full range of precision tools for a variety of semiconductor wafer processes. KELLENBERGER 600 U-125 provides a controllable grinding and lapping process, creating conditions that are ideal for optimal control of material removal rates. The machine also offers advanced cooling capabilities and a range of powerful cutting tools. The tool's grinding stages utilize ultra-precision grinding spindles driven by direct-drive motors, allowing for greater control and accuracy. It features a 7-Head omni-directional spindle, capable of longitudinal or traverse movement, that can handle different types of semi-abrasive components with ease and superior surface finish. The asset also boasts a high-performance grinding head for ultra-precision grinding and lapping of wafers of any geometry. The model also includes a robust, high-accuracy milling spindle, capable of greater adjustment and control. For reliable and efficient lapping and polishing operations, 600 U-125 offers an array of advanced features. A unique lapping tool is included that allows for rapid slurry introduction and removal from the part surface. The equipment also includes an advanced-performance micrometric feed that offers precise control of the grinding pressure and speed. A high-precision di-axial adjustable lapping system allows for advanced control of the lapping process. KELLENBERGER 600 U-125's cooling unit utilizes compressed air to eliminate static heat build-up and provide improved thermal management, thus reducing the amount of pollutants released during the wafer grinding and lapping process. The machine utilizes a unique cooling plenum for precise cooling per process step. The cooling plenum is designed to provide directional cooling during the grinding and lapping process, thus limiting the amount of heat and dust released during the process. To ensure accurate, repeatable surface finishes, 600 U-125 tool includes an advanced pressure control asset for controlling the grinding and lapping process. The model also includes optical and imperial micrometers for accurate measurements. An advanced automated wafer handling equipment is also included that enables accurate part placement and retrieval from the machine. KELLENBERGER 600 U-125 is an advanced wafer grinding, lapping, and polishing system that includes a range of key features for increased precision and superior surface finishes. The unit's features enable superior surface finishes and greatly reduced environmental impact, making it an ideal choice for semiconductor wafer fabrication operations.