Used KELLENBERGER UR 250 V 1000 #9052584 for sale

KELLENBERGER UR 250 V 1000 is a state-of-the-art wafer grinding, lapping, and polishing equipment that can be used to process ultra-thin substrates up to 3 mm in thickness. This system utilizes advanced technology to precisely and consistently abrade the surface of a wafer. The unit is designed with a patented air-bearing spindle and high-efficiency motor that are optimized to deliver a high degree of precision. One of the key features of UR 250 V 1000 is its high-precision SPM (sequential pattern recognition) technology. This technology allows the user to accurately control the grinding, lapping, and polishing processes. It can also detect any objects that present a course of action, such as a low angle or an obstructive feature. This allows for optimal grinding and polishing conditions. KELLENBERGER UR 250 V 1000 is designed to provide superior results for the production of ultra-thin wafers. It features a powerful cutting spindle that is capable of providing an effective grinding rate of up to 3300 rpm. This enables the machine to be used for a wide range of applications, from removing microns of material to polishing to the expected level of finish desired. UR 250 V 1000 also features a touch-screen adapted control panel that can be used to program the tool to the desired parameters. This allows the user to adjust the grinding pressure, grinding speeds, and other parameters to adjust the process results. KELLENBERGER UR 250 V 1000 is designed for use in a variety of industries, from the semiconductor industry to medical device fabrication. This asset is capable of grinding and polishing complex geometries to an extraordinary degree of accuracy. This makes UR 250 V 1000 the ideal model for ultra-thin wafer production.