Used KEMET 24 #293637616 for sale

KEMET 24 is an advanced wafer grinding, lapping and polishing equipment designed to provide superior performance in a variety of wafer processing applications. Its design is based on the latest technology and a fully integrated control system. 24 unit uses an innovative grinding and lapping machine that utilizes advanced actuators and a rotary table to provide a uniform finish. This optimizes grinding and lapping speed, as well as lowers cycle times compared to typical industry standards. The tool is capable of processing wafers with a thickness range of 25 - 600 microns and a surface roughness of 3 - 6 N1. KEMET 24 has advanced control systems that enable accurate and rapid feedback on the process. This includes recognizing any faults or abnormalities in the process. It also provides advanced features like the ability to dynamically control parameters such as grinding angle, pressure and speed. This ensures high quality grinding and lapping at precisely the right parameters. The asset is optimized for temperature consistency, making it well suited for high-temperature processes. The advanced temperature sensors monitor and control the temperature of each grinding step, thus ensuring minimal temperature variation. The model also offers a wide range of abrasives and grinding pads for a variety of materials and applications. To ensure the highest level of accuracy and reliability, 24 has been designed with a high-precision axis motion equipment. This includes a direct-drive motor, encoder, linear guide and precision timer for accurate motion control. In addition, the system incorporates a CCD high-resolution camera to capture and analyze real-time wafer images. Overall, KEMET 24 is an advanced and highly optimized unit for wafer grinding, lapping and polishing. The machine provides high-precision results, fast cycle times and a wide range of abrasives to handle a variety of materials and applications. As such, 24 is an ideal tool for leading edge microelectronic and optoelectronic wafer processing applications.