Used KEMET 36 #293653015 for sale

KEMET 36 is a wafer grinding, lapping and polishing equipment engineered for manufacturers wishing to produce a high precision surface on IC wafers. The system is capable of producing some of the best wafer finishes available on the market today. 36 unit consists of a mechanical grinding and polishing stage which utilizes diamond grit to achieve the desired finish, followed by a chemical mechanical polishing stage which further enhances the surface finish. The mechanical stage uses a vibratory table to agitate the wafers and remove any roughness. The diamond grinding wheel then grinds down the entire surface of the substrate to the desired thickness and accuracy. The chemical mechanical polishing stage utilizes a carousel which immerses the wafer in a chemically-treated suspension medium which removes additional ions, gasses and particles. KEMET 36 also features dynamic vibratory control, powerful pressure feed and air filtration systems, and a high-speed belt machine. The dynamic vibratory control ensures that no noticeable surface irregularities occur, while the powerful pressure feed and air filtration systems ensure clean, crystal-clear results. To further maximize precision, the high-speed belt tool precisely grinds the surface of the wafer to the required thickness or accuracy. 36 wafer grinding, lapping and polishing asset provides superior accuracy, flexibility and reliability at an affordable price point. It is an ideal choice for producing high-precision wafers for the semiconductor, MEMS and emerging markets. This wafer grinding, lapping and polishing model is a valuable investment for manufacturers striving for success in today's competitive environment.