Used KEMET XJ 56 #293614825 for sale

ID: 293614825
Vintage: 2011
Wafer polisher Platen diameter: 1420 mm Platen material: Stainless steel 304 Drive motor power: 40 HP Gearbox: 25:1 Motor speed: 0-70 rpm Temperature control: Probe on platen Variable inverter for speed control Chiller routing for platen: 30 L/min with φ25 mm Thickness of platen: 45 mm 2-Steps carrier alignment with retainer Direct pressure distribution Work piece holding plates diameter: 546 mm Contact pressure: 0-400 kgs Pressure range: 0-300 kgs Cylinder bore diameter: 130 mm Cylinder stoke length: 220 mm to 230 mm Carrier size: 5546 mm Carrier material: Ceramic Rotation mechanism: Positive drive with clockwise / Counter clockwise functions Power supply: 480 V, 50 Hz, 3-Phase / 24/220 V, Single phase 2011 vintage.
'KEMET XJ 56' is a wafer grinding, lapping & polishing equipment designed to meet the needs of the semiconductor industry. It is a fully automated grinding, lapping and polishing system that is able to take over processes that have traditionally been done manually. XJ 56 uses a range of technologies to achieve repeatable and reliable results. It uses a four-axis grinding and lapping table to adjust and control the process in four directions (X, Y, Z, and theta). This flexible unit can process round, square, rectangular, and any other shape of wafer. It accommodates a range of components with a range of sizes and thicknesses, ranging from 75mm to 300mm in length and from 5mm to 25mm in width. The machine is easy to use, with an intuitive, user-friendly interface. The grinding, lapping and polishing stages are driven by the integrated control tool and ensure repeatability and control. This asset is specifically designed for the semiconductor industry, using a high-end industrial 3D scanning mechanism to ensure accuracy and repeatability. It is capable of attaining surface finishes ranging from 0.1μm to 0.5μm, which is highly suitable for semiconductor applications. The integrated control model supports a variety of post-processing functions such as selective polishing, slow-drying, plasma etching, or cleaning, to achieve superior quality results. It can process a variety of components with variable thicknesses and is equipped with a wide range of interchangeable tools such as grinding tools, diamond grinding tools, polishing tools, and various abrasives. This makes the equipment suitable to work with all kinds of materials, even the most difficult-to-grind materials with low deformation. KEMET XJ 56 features a low-maintenance operation and a number of safety features to ensure that the process is operated in a safe and secure environment. It is also equipped with a feedback system to detect malfunctions and to ensure optimal process control and repeatability. Finally, its modular design allows for the customization of components and processes, making it suitable for a wide range of applications.
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