Used KENT KGS-200S #9059694 for sale

KENT KGS-200S is a state-of-the-art wafer grinding, lapping, and polishing equipment. Its precision features make it a feasible solution for the electronics industry as well as other semi-conductor applications. This wafer processing system provides repeatable, fast, and highly automated die cutting, wafer thinning and grinding operations. KGS-200S has an integrated flat-surfaced grinding and polishing function which allows users to grind and polish wafers in stunning precision and accuracy at high speeds. It uses high-efficiency, lapping unit including a precision spindle motor, which provides a smooth process with minimized chatter marks. This machine is capable of precise grinding and polishing operations up to 90µm with very low defects. KENT KGS-200S can easily handle both die-cut and singulated wafers, eliminating the need for manual handling and the associated costs. KGS-200S features an intuitive, user-friendly touch-screen interface that supports a simple user-guided machine teaching process. This programmable interface also enables users to quickly adjust parameters such as spindle speed and trajectory, enabling customers to customize the grinding and polishing process to their exact needs. On top of this, KENT KGS-200S also supports multiple wafer sizes - from small 8 inch to large 12 inch wafers - making it a versatile choice for different application requirements. The KYNAR-coated grinding wheel ensures a fast grinding and polishing process, with low surface roughness and minimal waste. Its unique multi-wheel technology allows for high grades of smoothness, producing perfect bubbles without any chip-control issues. Additionally, KGS-200S is equipped with a state-of-the-art vacuum wafer chucking tool which ensures the perfect chucking, grinding and polishing of wafers in a controlled atmosphere. KENT KGS-200S also includes a tilt-correcting mechanism that provides spherical accuracy even when the substrate is slightly tilted. This asset is extremely useful when grinding and polishing large substrates and offers high yield with uniformity and low defect rate. In conclusion, KGS-200S is a highly-engineered, wafer grinding, lapping and polishing model that offers great flexibility and accuracy for a variety of semi-conductor applications. This equipment is capable of repeatable, fast and highly automated operations, with simple user-guided machine teaching setup. The KYNAR-coated grinding wheel together with its multi-wheel technology allow for superior smoothness and precise results over a wide range of applications. The advanced tilt-correcting mechanism ensures high yield even for large substrates and the vacuum chucking system guarantees exact wafer chucking, grinding and polishing in a controlled atmosphere. All these features make KENT KGS-200S an excellent choice for any semi-conductor applications.