Used KENT KGS-63WM1 #293667289 for sale

KENT KGS-63WM1 is a wafer grinding, lapping and polishing equipment designed to provide precise surface profiles for a variety of semiconductor components. The system consists of two main components, the Wafer Grinder and the Wafer Polisher. The Wafer Grinder is a semi-automated grinding machine that uses a special diamond-plated abrasive to grind wafers into a uniform flatness. It is capable of producing excellent surface finish, with exceptional flatness control and surface roughness uniformity. The Wafer Polisher is a fully automated lapping and polishing unit that uses diamond-plated and polyimide films to provide a precise surface finish on semiconductor components. The polishing process is controlled by an advanced computer-controlled computerized polishing program that uses an array of manipulated parameters to accurately create the desired surface. The machine is capable of producing flatness values as low as 0.4 microns, and surface roughness values of 0.005 microns. KGS-63WM1 comes with standard polished wafers installed, however the user can customize the tool to meet their specific needs. The machine also includes several sets of grinding, lapping and polishing settings, including various feed rates, speeds, and pressure settings to ensure optimum performance. Additionally the asset also offers the user the ability to easily adjust, modify or save existing settings. The machine is also equipped with a wafer heating model, which enables the user to heat the wafer to specific temperatures for an optimal polishing process. The waste disposal equipment allows the user to easily and quickly remove any waste material produced from the grinding and lapping process, preventing environmental contamination. The machine also incorporates an array of safety features, as well as a built-in dust extraction system to keep the working environment safe and clean. Overall, KENT KGS-63WM1 is a reliable and versatile wafer grinding, lapping and polishing unit, which is capable of consistently producing a wide range of excellent surface finish results. Its flexibility and user friendly features make it an ideal solution for a wide variety of semiconductor applications.