Used KIZI KD24BX #9260755 for sale

KIZI KD24BX is an automated wafer grinding, lapping and polishing equipment designed for the semiconductor industry, with cutting-edge features that make it one of the most advanced tools of its kind. With its powerful motor and variable speed controls, the system is capable of grinding a wide range of substrate materials, as well as lapping and polishing them to a high finish. The unit also features a fully-synchronized dual-axis platform, providing optimal positioning and synchronization of grinding, lapping and polishing motions. KD24BX is equipped with multiple features that make it suitable for many different types of wafer grinding, lapping and polishing requirements. Its two-axis platform can reach a tilt angle of up to 75⁰, enabling polishing across a wide range of angles. The machine also features high accuracy and repeatability with its choice of manual or motorized grinders, allowing for precise grinding and lapping operations. The tool also includes a fully adjustable polishing head which can be set to a variety of different speeds and pressures for precise polishing. KIZI KD24BX is a fully enclosed asset, blocking the user from contact with hazardous rotating surfaces while protecting the device from generating any dust or debris. Additionally, the model is equipped with a range of safety features which include anti-jam protection, an overload protection mechanism and a designed-in motor brake. The equipment also has an integrated set of sensors, which can measure and monitor information such as the speed of the spindle and the intensity of the grinding action. This allows the operator to adjust or control the system's performance in order to ensure proper functionality. In terms of its capabilities, KD24BX is an extremely powerful unit capable of producing consistent, repeatable and repeatable results. Its combination of state-of-the-art features, combined with superior accuracy and efficiency, make it the ideal choice for any wafer processing operation.