Used KO LEE B709NFP6L #9114509 for sale

KO LEE B709NFP6L is a state-of-the-art wafer grinding, lapping and polishing equipment. This system is designed to create the highest quality surfaces possible on a wide variety of wafer types. The unit includes load frames, grinding spindles, motorized stages and precision metrology instruments built into a single package. This machine is the perfect solution for precision wafer machining or prototype manufacturing. The tool uses a variety of different techniques/processes throughout, including grinding, lapping and polishing. Grinding is done to reduce the thickness of the wafer, while lapping is used to create smooth, flat surfaces. Polishing is done to further refine these surfaces and achieve the highest possible precision and quality of the wafer. B709NFP6L asset is built with a robust thermally stable construction and features a flexible, open design for maximum efficiency. The machine is capable of processing various sized wafers, ranging from 75mm to 300mm in size. There is also an option for a larger 450mm wafer size if required. The model uses a high speed spindle which offers a maximum speed of 35,000 rpm and is capable of extremely precise machining. The spindles are designed to accurately follow the contours of the wafer ensuring optimal surface quality. In addition, the equipment is fitted with a Closed Loop Control to ensure consistent results. This control works to continuously monitor the wafer's surface and make adjustments according to the operator's requirements. The grinding, lapping and polishing processes of KO LEE B709NFP6L are all controlled and monitored by sophisticated metrology systems. State-of-the-art OnDisc Technology is used to analyze the surface characteristics of the wafer and ensure optimal results. The system also has on board integration for external measuring and control instruments, including autofocus microscopes, white light interferometers, and scanning probe microscopes. B709NFP6L is an advanced wafer grinding, lapping and polishing unit that offers superior accuracy and repeatability. Thanks to robust construction, highly precise spindles and sophisticated metrology systems, this machine is the perfect choice for unprecedented surface quality and accuracy.