Used KO LEE S714H #9137727 for sale

KO LEE S714H is a precision wafer grinding, lapping, and polishing equipment that is designed for low and medium volume production applications. This system provides the highest quality and repeatability achievable in high tech processing. S714H features a two piece stainless steel vacuum table and two precision heads to accommodate a variety of wafer sizes. The table is easily adjustable to accommodate a variety of applications with continuously varying grinding and lapping plane offsets. The unit's controls and software allow for a very wide range of wafer sizes, up to a diameter of 6". The grind and lap diamond tools supplied with KO LEE S714H are of the highest quality. These special tools have been designed with small diamond particles to ensure the highest levels of process repeatability for your specific application. The diamond tools have been tested and designed for minimal contamination of the substrates and minimal surface roughness. The tools have also been engineered to ensure a low thermal expansion coefficient for superior reliability when using S714H. The grinding and lapping tools can be preloaded into the grinding head using a patented tool-in-place loading process. This process ensures that the diamond abrasives remain precisely aligned with the wafer during the grinding and lapping cycles, and automatically compensates for any imperfections in the substrate. KO LEE S714H features a self-indexing tool loading machine to ensure repeatable and consistent process parameters. The grinding and lapping cycles are controlled by a powerful on-board microprocessor. This microprocessor monitors wafer speed and tool rotation speed throughout the process cycle. Settings can be easily fine tuned or modified with the touch of a button on the user friendly graphical interface. S714H is equipped with an ultra responsive polishing head that can cover any wafer area up to 6" in diameter. This feature includes a floating and compensating work head that molds itself to any imperfections in the wafer, resulting in uniform polishing across the wafer surface. The high responsiveness of the polishing head ensures superior results with every wafer and every polishing cycle. KO LEE S714H is an engineering marvel that is designed to provide the highest precision processes with low and medium volume production applications. This highly capable machine is a reliable and cost effective solution for wafer grinding, lapping, and polishing. It provides consistent results and delivers the best results possible.