Used KONDO CGK-450 #9156678 for sale

KONDO CGK-450 is a wafer grinding, lapping and polishing equipment that is designed for the processing of semiconductor wafers. It consists of three basic components: the grinding plate, the lapping plate, and the polishing plate, all housed in one unit. The grinding plate is equipped with up to four grinding abrasive wheels which are adjustable both vertically and horizontally. It is also adjustable in terms of rotation speed and tilt angle, allowing for a wide range of wafer sizes and shapes to be processed. This ensures that the wafers are treated uniformly and finish surface roughness can be controlled. The lapping plate uses a rotating plate of abrasive material such as diamond which is able to uniformly apply mm-level precision to wafer's flatness. The lapping plate is also adjustable to control speed, tilt angle, and also has a central positioning wheel which allows for exact centering of the lapping process. The polishing plate is designed for the smooth and consistent finish on wafers once the grinding and lapping processes have been completed. It uses a rotating plate of soft and flexible polishing pads which can be adjusted in both speed and angle. This ensures a thorough finish on the wafer surface. CGK-450 is also equipped with a working area under the central motor. This provides additional space for tool storage, wafer handling, and safety equipment. All of this combines to form a comprehensive and efficient wafer grinding, lapping and polishing system. In terms of safety, KONDO CGK-450 is equipped with an emergency stop button, "occlusion devices", and on/off indicator lights. This ensures that the operator remains safe while using the machine. Furthermore, due to its modular design, maintenance and setup of the unit is relatively straightforward. Overall, CGK-450 is a reliable and efficient wafer grinding, lapping and polishing machine. Its modular design and adjustable components make it ideal for processing a variety of wafer sizes, shapes and materials. In addition, the tool is manufactured in accordance with safety guidelines to protect users from harm. This ensures that it is suitable for a wide range of wafer processing requirements.