Used KURODA GS-52PF #293604978 for sale

KURODA GS-52PF is a wafer grinding, lapping and polishing equipment, designed to finish and process oversized and thin wafers into FOUP-standard Silicon and Gallium-Arsenide substrates. The system comprises of high-precision grinding and polishing units, with up to four main grinding and polishing heads. The main advantage of the unit is its flexible, multi-directional rotation capability, which allows the grinding, lapping and polishing of even the most complex and irregularly shaped components. The machine uses a rotating surface grinding wheel, equipped with a diamond-coated abrasive, to remove excess material and uneven surfaces on the wafer. The open-cast aluminum grinding wheel is mounted on a rotatable base, with a swing-arm and angle control to provide fine positional control. The stroke and speed of the grinding wheel are adjustable to achieve the desired precision and surface finish. The lapping process uses a specially designed lapping plate that is mounted on a rotatable base, and uses a combination of mechanical and electrostatic forces to thoroughly polish and resurface smooth, flat surfaces. The plate is driven by a high speed motor, which allows for positioning and surface finishing to nanometer tolerances. The lapping plate is followed by a polishing unit, also mounted on a rotatable base, which uses ultra-fine diamond abrasion to reduce surface roughness. GS-52PF provides superb results in terms of surface finish, size accuracy and material removal efficiency. It can be used to finish a wide range of materials and components, including Silicon, Sapphire and Gallium Arsenide from up to 8" (200 mm) in size. This makes it ideal for use in high-end manufacturing applications and both consumer and enterprise research laboratories. KURODA GS-52PF's advanced technologies and designs provide a low cost of ownership and the tool offers a long lasting and reliable performance. The asset minimizes maintenance needs and allows for easy operation, with user-friendly and intuitive controls. Furthermore, its higher productivity levels help reduce downtime and improve process efficiency.