Used KWANG JIN KJ-0-02 #9216421 for sale
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KWANG JIN KJ-0-02 is a wafer grinding, lapping & polishing equipment designed for customizable system integration. It is a compact solution for precision processing of wafers and small workpieces. It utilizes the latest technology in abrading components and features a quiet and clean operation in order to provide excellent surface finishes. KJ-0-02 features an encoder control unit, allowing for precise grinding and lapping efficiency. This control machine measures the speed and direction of movement of the grinding and lapping heads in order to provide superior accuracy and consistent performance. It is capable of processing flat and non-flat surfaces and is compatible with many types of grinding, lapping, and polishing compounds and diamond films. The tool's grinding heads are made up of soft aluminum alloy, featuring low energy consumption and noise levels. They are designed to minimize material disruptions while achieving high accuracy. The lapping heads are composed of rigid and lightweight elements, allowing for smooth and quick operation. KWANG JIN KJ-0-02 features a range of operational settings, including cycle time and number of passes, enabling its users to get the desired results quickly and cleanly. The asset is equipped with a pressure sensor to monitor the precise operation of the grinding and lapping heads, and a fully enclosed filters which help ensure dust-free air for safe operation. Furthermore, KJ-0-02 utilizes an extensive cooling model to provide efficient rapid cooling and uniform temperature distribution throughout the process, thus helping reduce heat build-up to ensure consistent results. KWANG JIN KJ-0-02 is an invaluable tool for wafer grinding, lapping, and polishing. Its advanced design and features will help meet the highest standards of precision and speed in the manufacturing industry.
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