Used KWANG JIN KJ-0-04 #9216420 for sale

KWANG JIN KJ-0-04 wafer grinding, lapping, and polishing equipment is a turn-key, fully automated, and comprehensive metallographically-defined planarization solution. It is designed to ensure the highest levels of process repeatability and accuracy in a variety of industrial wafer and top-painting applications. The machine is equipped with a precision floating work stage that supports round and long rectangular wafers with thicknesses of up to 2.5mm. An integrated roller magazine stores up to a total of 30 wafer cassettes, each with a capacity of 15 wafers, for uninterrupted processing. It is capable of grinding lapping, and polishing at speeds up to 500rpm, while holding the surface flatness as low as 0.001mm. KJ-0-04 is powered by a programmable PLC system and includes a touch-screen intuitive user interface. This allows for adaptive programming and full control over the feedrate, pressure, and stroke of the grinding, lapping, and polishing processes to achieve the desired results. A built-in water and abrasive delivery unit controls all fluids necessary for operation and is also capable of hosting permanent storage and flushing through external tanks. KWANG JIN KJ-0-04 is an excellent choice for a variety of wafer grinding, lapping, and polishing projects. It ensures optimum planarization and surface finish on a wide variety of substrates, including but not limited to semiconductor wafers, display glass substrates, sapphire, quartz, mirror polished substrates, and other industrial surfaces. The PLC machine also supports an off-line process simulation for both grinding and polishing applications, which can be used to test and refine grinding and polishing programs. In summary, KJ-0-04 wafer grinding, lapping and polishing tool offers an adaptive, easily programmable, highly accurate, and reliable approach for planarizing almost any substrate, with the ability to host a wide variety of process parameters for optimum control and repeatability.