Used KWIK-WAY Model H #9023905 for sale

KWIK-WAY Model H is an advanced equipment for the grinding, lapping and polishing of wafers. Specifically designed for use in the semiconductor industry, Model H is capable of meeting the most demanding requirements for precision and reliability. The grinding, lapping and polishing process uses a unique spindle and grinding wheel system to provide a consistent, controlled and highly accurate form. The spindle consists of a main hub connected to a series of interleaved peripheral bearings. This adjustable hub is mounted on air bearings, which enable high-precision movement with minimal friction, providing a smooth and quiet operation. The grinding wheel is driven by a variable-speed motor with low-end speed control down to 500 r.pm., enabling precise control over the particle size. The lapping phase uses a precision piezoelectric motor for highly accurate movement, with a maximum speed of 10,000 r.pm. The lap disk is mounted to the spindle and a center pin ensures that it is kept in perfect alignment. The polishing phase then uses the precision motor to control the contact pressure and to maximize the wafer's surface quality. KWIK-WAY Model H also features an intuitive graphical user interface. This allows users to easily control the grinding, lapping and polishing sequence, as well as monitor essential unit data and statistics. It also features safety features such as integrated guards and automatic shut off switches for enhanced security and peace of mind. Model H is a reliable and accurate machine for the grinding, lapping and polishing of wafers. It is highly precise, with a flexible spindle tool and intuitive graphical user interface, allowing users to achieve maximum accuracy and control. It is suitable for use in a variety of products fabrication processes, and is the ideal solution for those requiring the highest quality results.