Used KYORITSU SEIKI GV1-20HAW-PF #293664109 for sale

KYORITSU SEIKI GV1-20HAW-PF is a wafer grinding, lapping, and polishing equipment that is designed to precision grind, lap, and polish silicon wafers with a maximum diameter of 150mm and a thickness range from 25~300 µm. The system is capable of working at speeds up to 10,000 rpm and can achieve an excellent surface finish. The unit incorporates a spindle motor that drives the rotation of the grinding, lapping and polishing discs. The machine is equipped with a direct-drive spindle motor that delivers high accuracy, reliability, speed and power. It is capable of automatic polishing of wafers to achieve the desired grinding and polishing quality. The machine is designed with an innovative and patented power transfer tool that allows for the efficient and precise transfer of power between the grinding, lapping and polishing discs. This asset utilizes a two-stage transmission that compensates for the different rotation angles of the grinding, lapping and polishing discs. This ensures that the power transfer model remains efficient and precise at all times. The equipment includes an automated grinding and lapping machine with an ergonomic operation panel. The system also has a programmable spark tester that accurately measures the polishing quality of the wafers. It has a superior dust collecting unit for efficient dust removal. The machine is designed with a variety of accessories and fixtures including, but not limited to, carriers for loading wafers onto the tool, polishing pads, mandrels, spindles, and special tools for the grinding and lapping operations. This asset is also equipped with a gas flow model that assures the precise control of grinding and polishing fluids for excellent results in grinding, lapping and polishing of wafers. GV1-20HAW-PF is a highly advanced and reliable wafer grinding, lapping and polishing equipment. It is designed to provide the highest quality of grinding and polishing with minimal contamination and excellent surface finish. With its user-friendly interface and advanced power, lapping and polishing system capabilities, KYORITSU SEIKI GV1-20HAW-PF provides a complete solution for all wafer grinding, lapping and polishing needs.