Used KYORITSU SEIKI GV1-20HAW #293664108 for sale

KYORITSU SEIKI GV1-20HAW is a wafer grinding, lapping, and polishing equipment designed for all types of semiconductor wafer applications, including backgrinding, thin wafer finishing, and ultra-fine polishing processes. It features a high-power, high-accuracy grinding spindle and advanced servo control systems for precise motion and positioning. The system is capable of controlling the pressure, speed, and acceleration of the grinding spindle for optimized processing operations. GV1-20HAW includes dual-sided polishing plates, allowing for simultaneous grinding and polishing operations on the same wafer. The advanced polishing mechanism includes a variable-slope and profile-control systems with manual as well as fully-automated profile optimization capabilities. The unit also includes a cost-effective lapping machine featuring three independently-controlled lapping platen stages for accurate and efficient wafer finishing processes. The tool can be equipped with a wide variety of accessories, such as special abrasives, processing fixtures, and surface measuring systems for customizable processes. The asset is designed with robust safety features, including an operator-friendly interface, overhead safety guards, and emergency-shut off model. KYORITSU SEIKI GV1-20HAW is a versatile, precise, and reliable wafer grinding, lapping, and polishing equipment that is capable of providing high-quality results for many types of semiconductor wafer applications.