Used KYORITSU SEIKI GV1-20HAW #9395755 for sale

KYORITSU SEIKI GV1-20HAW equipment is an advanced wafer grinding, lapping and polishing system designed for precise sample preparation. It is a highly specialized unit used to machine high quality, finished wafers to extremely exacting tolerances, providing unparalleled accuracy and efficiency for the most advanced operations. The machine is driven by a powerful electric motor that uses a spindle-based tool to induce high frequency rotations. This allows for a high degree of control over the rotation speed, allowing the operator to obtain the desired finished product with ease. The large, main wheels are made from diamond-infused, lightweight aluminum with adjustable diameters, enabling the operator to precisely control the level of grinding and lapping. The large stone wheels are adjustable in size and are made from abrasive materials such as diamond particles, enabling the operator to obtain the desired grain size for optimal lapping operations. The asset uses a vacuum-based fluid delivery model to ensure the cleanliness of the lapping surface and remove dust particles, minimizing the risk of contamination. The equipment is also equipped with a spray mist to further reduce the risk of contamination and ensure the accuracy of the wafer surface finish. GV1-20HAW is highly efficient, enabling the operator to optimize the wafers for consistent surface finish with a high degree of accuracy and speed. It is also supplied with a wide range of charge-plate accessories and consumable parts that further optimize its efficiency, such as grinding plates, abrasive papers, filtering elements, and pumps. This allows for the precision control of numerous facets involved in the grinding, lapping and polishing operations. The system is capable of both wet and dry applications, and is highly configurable depending on the particular characteristics of the wafers being processed. The user-friendly control panel enables the operator to quickly modify the settings and parameters as necessary, ensuring an optimal end product with minimal downtime. Overall, KYORITSU SEIKI GV1-20HAW is a highly specialized and sophisticated wafer grinding, lapping and polishing unit. It provides unparalleled accuracy and efficiency, delivering precise, professional-quality wafer surfaces with minimised contamination. The user-friendly interface, coupled with a wide range of charge-plate accessories, makes it an ideal machine for achieving the highest possible standards of wafer preparation.