Used KYORITSU SEIKI KCG6-80H #293664117 for sale

KYORITSU SEIKI KCG6-80H is a tool designed for grinding, lapping and polishing various types of semiconductor, optoelectronic, and mechanical components. The equipment utilizes wet grinding technology which employs the use of coolant fluids to get more efficient grinding performance while not compromising the accuracy of the system. The unit also includes a worktable that allows multiple parts to be processed simultaneously. KCG6-80H is constructed of a high-precision spindles and precision slides for the most accurate and precise grinding, lapping and polishing possible. The machine is designed with a closed-loop feedback control which enables smooth and constant revolution to ensure accuracy even if the grinding, lapping and polishing parameters being used change. The spindles operate between 0-218,000 RPM allowing for quick processing of components. The tool also has a built-in off-set auto-correcting feature that allows for quick and easy adjustments to minimize potential errors associated with improperly honed grinding points. KYORITSU SEIKI KCG6-80H also has an impressive array of safety features, including an automatic emergency stop for grinding, lapping and polishing operations in the event of a malfunction. The asset is covered by a retractable stainless steel protection cover which also minimizes the risk of environmental contamination from particles entering or leaving the work area. Additionally, the model also offers a variety of accessories like dresser trays, collecting trays, and grinding discs to help increase productivity. KCG6-80H is also highly automated. It allows users to easily select from a variety of preset grinding, lapping and polishing processes and automatically sets up and optimizes the equipment based on the chosen parameters. Furthermore, the system records all data pertaining to grinding, lapping and polishing conditions and results for easy access and review. Overall, KYORITSU SEIKI KCG6-80H is a high-performance, fully automated grinding, lapping and polishing unit that can improve the accuracy, consistency, and efficiency of a wide range of semiconductor, optoelectronic, and mechanical components. The machine is highly versatile and can be used both in mass production and research and development, making it one of the most reliable and cost-effective tools for grinding, lapping and polishing.