Used KYORITSU SEIKI KCG6-80H #293664123 for sale

KYORITSU SEIKI KCG6-80H is a next-generation wafer grinding, lapping & polishing equipment that is designed to perform high precision grinding, polishing and lapping operations. The system is capable of working with a wide range of materials including metals, ceramics, plastics, glass and polymers. The unit features an innovative dual-axis motor drive machine which enables precise grinding and polishing operations while minimizing thermal stress and thermal fatigue. The tool also features an efficient cooling asset which allows for rapid cooling of the parts when it is not in use. The cooling model also helps to extend the life of the machine and reduce maintenance costs. The equipment features two independent grinding stations, each capable of working with up to 14 wafers at a time. The wafers can be precisely positioned using the coarse, fine, and fine-adjustable stage controls. The grinding operation can be further adjusted using the adjustable spindle speed and pressure settings. The spindles are also designed to provide the operator with maximum control and flexibility during the grinding process. The system also features a lapping and polishing stand. The stand is designed to provide the operator with a smooth, even finish and maximum control over the lapping and polishing operation. The lapping and polishing stand is adjustable to provide the operator with a uniform velocity over varying surface areas. The unit also features a broad range of accessories which help in the efficient operation and maintenance of the machine. These accessories include surface adapters, quartz plates, long handles, and a power cord which helps in controlling the tool. Overall, KCG6-80H is an efficient, precise, and reliable wafer grinding, lapping & polishing asset. It is an ideal choice for any applications requiring a high degree of precision and repeatable results. The model is easy to use and the wide range of accessories makes it suitable for a variety of applications.