Used KYORITSU SEIKI KCG6-80H #293664143 for sale

KYORITSU SEIKI KCG6-80H is a wafer grinding, lapping & polishing equipment that provides a fast and precise method of finishing semiconductor wafers. It is designed to grind and polish to the highest level of quality and precision. The system is composed of an integrated grinding and lapping unit which grinds the surface of the wafer to the desired level and uses a series of diamond polishing and micro-polishing fabrics to lap and polish the surface to its final desired condition. The grinding wheel is housed in its own separate enclosure, which is environmentally controlled to ensure proper temperature and humidity levels while performing operations. The grinding unit is a multi-speed motorized unit that uses a precision and adjustable spindle to feed the wafer at a specific speed, while a variable speed drive (VSD) allows for precision adjustment while grinding the wafer. To ensure the highest quality finish, a high-grade diamond wheel is used to grind the surface of the wafer. The grinding force is precisely set to an optimal level to ensure that the most accurate result is achieved without removing too much material from the wafer. To ensure that the surface of the wafer is lapped and polished to the desired condition, the lapping and polishing unit is composed of 2 stages: the first stage is a rotary lap plate and the second a flat polishing pad. The rotary lap plate uses high-grade diamond and ceramic particles suspended in a high-viscosity liquid to lap the surface of the wafer in a 360° pattern; while the polishing pad is depressed by a roller and gently polishes the surface giving the desired results. To ensure that the wafer is perfectly smooth and free from any scratches, the machine includes an optional post cleansing process. This process uses a precision brush and high-pressure filtered air to effectively remove any impurities and remaining debris from the surface of the wafer. KCG6-80H is an advanced tool that is capable of producing a high level of precision and accuracy in a short amount of time. It is a cost-effective method for finishing wafers and its advanced features ensure maximum yields and productivity. It is highly reliable and efficient, making it the ideal choice for any wafer grinding, lapping and polishing needs.