Used KYOTSU-SEIKI KOH-0Z-S2/P2 #9045663 for sale

KYOTSU-SEIKI KOH-0Z-S2/P2 is a wafer grinding, lapping & polishing equipment designed for the high precision grinding and polishing of wide range of wafers. This system comes with a superior mechanical and operational design that is intended to provide the highest level of performance, reliability and precision for precision wafer grinding and polishing. The unit includes two control panels; one for grinding and one for polishing. The grinding panel is designed to control the grinding cycle time accurately and applies a load of up to 6.3 poise to the wafer during each grinding cycle. It also offers a wide programmable grinding pressure range and temperature settings; making it possible to adjust the surface roughness and grind repeatability of the wafers. The operator can use the grinding wheels of different sizes depending on the requirements of the materials to be processed. The polishing panel provides an automatic continuous polishing time and temperature control to obtain specific surface requirements. The machine also has a programmable polishing pressure range and temperature settings to guarantee excellent repeatability and surface quality. KYOTSU-SEIKI KOH-0Z-S2/P2 also features a fully automatic vibration dampening tool and advanced edge stabilization device. The vibration dampening asset reduces the vibration and noise that can affect the process accuracy and also the operator's productivity. The edge stabilization device aids in the correct positioning of the wafer during the polishing or grinding process and minimizes warping of the wafer edge with its advanced two-sided winder. KYOTSU-SEIKI KOH-0Z-S2/P2 wafer grinding, lapping & polishing model is designed for use in laboratories and production facilities that require efficient, precise and reproducible grinding and polishing processes. The equipment is capable of handling wafers with thicknesses ranging from 0.1 mm to 6 mm. The system can also be configured with a variety of wafer grinding, lapping and polishing materials including grindstones, diamond wheels, diamond films, polish pads and other consumables. The unit has been designed to meet or exceed international process standards, hence, guaranteeing reliable, high-precision processes and consistent results.