Used KYOTSU-SEIKI Y-1000 #9257665 for sale

KYOTSU-SEIKI Y-1000 Wafer Grinding, Lapping & Polishing System is a fully automated, high performance solution designed for precision and repeatability in the manufacturing of planar and non-planar wafer surfaces. The system is capable of grinding, polishing, and lapping of a wide range of semiconductor materials, such as silicon, germanium, gallium arsenide, indium phosphide, sapphire, and other electro-optic materials. Y-1000 offers a comprehensive set of process options, each optimized for various applications and wafer configurations. The back grinding process is designed to achieve advanced machined-like finish to allow for strong adhesion between wafer layers. The lapping process is for achieving sub 0.2μm surface finishes while the diamond polishing process is ideal for achieving surface finishes below 1nm. The wafers are precision mounted with optical micro-registration pins for precise machining. An advanced moveable wafer handler automates the loading and unloading process. KYOTSU-SEIKI Y-1000 includes a fully enclosed operating chamber and is designed to minimize dust emissions. An infrared gas supply system is available for performing single- and double-side processing at outgassing temperatures as low as 800°C. Y-1000 utilizes a 32-bit RISC processor for control and a highly sensitive load sensor for precise pressure control. It comes with a 7-inch touch display for process parameter input. An array of process parameter options allows for fine-tuning to specifics customer needs and processes. KYOTSU-SEIKI Y-1000 is designed to comply with CE and RoHS standards and includes best-in-class warranty and service support. It also meets stringent sustainability requirements, as Y-1000 is designed for efficient use of resources and minimal environmental impact.