Used LAM RESEARCH Teres #9016446 for sale

LAM RESEARCH Teres is an advanced wafer grinding, lapping & polishing equipment that delivers precise, repeatable results for a wide range of applications. Teres is an all-in-one system that offers precise material removal, surface smoothing, and thinning, as well as precise control of the resulting surface finish and lapping film properties. This unit enables superior surface quality and consistent results, enabling repeatable, reliable fabrication processes. LAM RESEARCH Teres consists of five process sections: Grinding, Lapping, Polishing, Film Thickness Control, and Transducer Calibration. The grinding section utilises two diamond cBN grinding wheels and a composite abrasive wheel to grind wafers down to the desired size. It also incorporates a vacuum chuck that provides consistent, repeatable results to enable precise thinning of the wafer for polishing. Teres' lapping section utilises a unique design to enable efficient and precise wafer lapping and film deposition. This machine is capable of processing up to four wafers simultaneously, and can achieve reductions of 0.001-0.002mm, enabling ultra-fine surface smoothing. The quality of the resulting film properties is also exceptionally high, resulting in a highly consistent, reproducible surface with low surface inhomogeneities. LAM RESEARCH Teres' polishing section is specifically designed to achieve superior accuracy and quality. It utilises an automated wafer transfer tool, central robotic arm and programmable drive motors to enable precise, repeatable processing of wafers. The asset is also equipped with a built-in defect inspection model that monitors defects and aberration in real-time, enabling superior process control. Teres Film Thickness Control equipment provides precise material removal and surface finish control by accurately controlling the distance between the substrate and the abrasive. This system offers both automatic thickness control and manual overrides, enabling fast and simple processing of wafers. The Transducer Calibration unit is used to precisely measure and control the pressure and speed of the abrasive during wafer processing. In summary, LAM RESEARCH Teres is an advanced wafer grinding, lapping & polishing machine that delivers precise, repeatable results with superior precision and surface quality. It combines a variety of process sections, designed to provide efficient and consistent processing of wafers. This tool is capable of reaching fine lapping and film properties, while providing a variety of options for manual control and thickness control. The result is consistently reproducible surfaces with low surface inhomogeneities and fast, simple processing.