Used LANDIS CINCINNATI RK Series 350-20 #9356511 for sale

LANDIS CINCINNATI RK Series 350-20 is a wafer grinding, lapping, and polishing equipment that features a rotating disk that allows for grinding, lapping, and polishing of multiple wafers simultaneously. The grinding disk can rotate at high speeds and is capable of executing several different operations. The disk can also be adjusted to optimize chip and die production. The grinding process is optimized by the use of a segmented diamond cutting head that provides optimal contact between the head and the wafer. The wafer grinding station also includes various lapping and polishing capabilities to improve surface finish and texture, as well as a metallographic polishing option to create a uniform surface finish on the sample. The system is equipped with a variety of features such as a CNC controller and integrated software that allow the user to have greater control over the grinding process, as well as advanced safety features such as light curtains and adjustable guards. The unit also comes with a variety of accessories such as an automated wafer loading machine and an automated cleaning tool to ensure a continual grinding and polishing process. RK Series 350-20 offers a flexible, efficient, and reliable grinding, lapping, and polishing process. With its fast speeds, adjustable parameters, and integrated software, the asset is capable of achieving an outstanding surface finish that will meet any detailed specifications. Furthermore, the model is highly reliable in operation and can be used to process a wide range of materials, including both silicon and sapphire. The equipment offers excellent stability, precision, and repeatability, so the user can be sure of the same results with each process cycle.