Used LAP MASTER 12B #9276661 for sale

LAP MASTER 12B is a state-of-the-art wafer grinding, lapping, and polishing equipment from Extec Corporation. This machine is designed to remove stock from wafers, and give them an accurate shape and surface finish. 12B is a single-sided machines that utilizes three-head technology as well as diamond abrasive tooling for increased cutting and polishing efficiency. This system has the ability to grind and polish wafers up to 12" in diameter. The precision engineered process of LAP MASTER 12B is accomplished by a synchronous drive unit consisting of powerful DC brushless motors driving the three-rotary grinding heads. It has the capacity to easily grind and polish wafers with a roughness value down to 5RA (ARL or N4 on a linear scale). The machine features independent head speed control, in-process wafer size identification, and a patented True Point compensation tool. The True Point compensator adjusts the head position while grinding and polishing to ensure accuracy. 12B is able to process large wafers to tight tolerances quickly and efficiently. LAP MASTER 12B process starts by mounting the wafer onto a carrier on the rotary table. The machine then proceeds to grind wafers using a diamond grinding wheel to achieve the desired shape and finish. Once the wafer has been shaped to the required specifications, the machine will then transition to the lapping process. This step uses a diamond-impregnated slurry to achieve a desired surface finish. This process is followed by a final polishing cycle with a slurried polishing pad to create a chromium oxide finish. Upon completion of 12B process, the wafer is unloaded and inspected for accuracy. LAP MASTER 12B asset is suitable for a wide range of applications from semiconductor manufacturing to scientific applications. This model is designed for industrial use and is built with rugged construction to ensure its long-term reliability. With its easy to use graphical user interface, advanced features, and high-precision grinding and polishing capabilities, 12B is an essential tool in the production of wafers.