Used LAP MASTER 15B #9276662 for sale

LAP MASTER 15B wafer grinding, lapping & polishing equipment is a state-of-the-art system designed to produce extremely flat, high quality surfaces on wafers. The unit can process any semiconductor wafer from one inch to six inches in diameter and is capable of producing surface finishes as low as 1 angstrom RMS. 15B is ideal for precision wafer processing applications. The machine has the unique capability to achieve sub-micron grind performance levels on aspheric, ferrous, and out-of-round shapes. The tool also features a wide range of abrasives for grinding, lapping, and polishing as well as a variety of backup plates. LAP MASTER 15B is equipped with an ergonomically designed control unit for manual operation. There are several individual user-friendly touchscreens that allow the operator to quickly select and operate the desired processes. The touchscreen controls provide a simple, straightforward way to select grinding, lapping, and polishing techniques and can be adjusted to modify parameters such as the amount of time, pressure, speed, and feed rate of the operation. The asset is driven by a powerful stepper motor with micro-stepping capability, ensuring precise and repeatable motions. The drive model also allows for quick process setup and tear down. 15B also incorporates an advanced lubrication equipment for optimal grinding performance. The system can accurately maintain the required orifice size and position for optimal chip size and uniformity throughout the wafer. An advanced wafer alignment unit is also included and can handle both manual and automatic operations. LAP MASTER 15B also includes an integrated cooling machine that keeps the tool's temperature within the acceptable range for wafer processing. 15B is an efficient, reliable, and precise tool for wafer processing. It is capable of producing high quality wafers with minimal waste and is ideal for a variety of application types.