Used LAPMASTER 12 #293755889 for sale

LAPMASTER 12 is a wafer grinding, lapping & polishing equipment that is designed to create a combination of high quality grinding, lapping, and polishing processes. LAPMASTER offers superior accuracy and surface finish; capable of achieving polish and surface finish on wafers of 12" in diameter and 0.5-5mm in thickness. The machine offers a low speed, continuous-duty drive motor for consistent and repeatable material removal rates. An additional motor can be added to the system for variable speed operations. The unit offers a user-friendly graphical user interface with pre-programmed recipes for most grinding, lapping, and polishing operations. LAPMASTER 12 utilizes a chemical-mechanical polishing (CMP) machine that includes an abrasive tool that spins around the surface of a wafer. The abrasive tool is designed to evenly and consistently polish the wafer's entire surface. The CMP tool offers precision material removal rates, better yields, and improved product quality. The machine is equipped with a unique two-stage grinding and lapping process. During the first stage, 12 uses a diamond grinding wheel to reduce the wafer's surface roughness. This process is followed by a second stage which utilizes fine diamond lapping pads to achieve the desired surface finish. The asset can also be used for single step grinding and lapping processes. Finally, the machine offers a unique electronic control model. This equipment allows users to optimally manage their processes by controlling the abrasive tool speed, pressure, and grinding parameters. The control system also automatically tracks the progress of the grinding, lapping, and polishing processes, letting users know when their job is complete. Overall, LAPMASTER 12 is a powerful and efficient 6" wafer grinding, lapping & polishing unit that offers superior accuracy and surface finish. With its user-friendly graphical user interface, pre-programmed recipes, and electronic control machine, it is clear that 12 is designed to be a reliable and efficient tool for the automated surface finish of 6" wafers.