Used LAPMASTER 12C #293821270 for sale

LAPMASTER 12C is a precision wafer grinding, lapping, and polishing equipment capable of achieving submicron accuracy in surface finish, flatness, and parallelism on various materials such as silicon, gallium arsenide, CR-39, and fused silica. This system is designed to accommodate wafers with a diameter ranging from 2" to 12" and enables users to perform dualside polishing and lapping simultaneously. Featuring an integrated LAPMASTER CNC controller, this unit removes the need to operate multiple separate machines and can save users time while providing consistent results. LAPMASTER 12 C has a host of features that ensures accuracy and repeatability when processing wafers. A three-axis motorized translation machine enables users to precisely manipulate wafers and easily set up polishing processes. Additionally, an intuitive interactive touch screen allows for user friendly setup and control of machine functions. An integrated machine diagnostics tool provides real-time feedback on the status of all components, ensuring faster service and maintenance. In terms of wafer grinding, 12C boasts a high accuracy grinding, lapping and polishing (GLP) head that affords users with increased accuracy for all grinding, lapping and polishing operations. The asset's advanced logical positioning (LOP) model enables concurrent grinding and lapping operations, and its powerful motorized polishing spindle provides an extra level of precision polishing. 12 C is a simple and intuitively designed yet powerful and versatile solution for precision wafer grinding, lapping, and polishing. Its low maintenance and reliable operation enables users to consistently achieve their desired results quickly and accurately. With its wide range of features and capacity, this equipment is a great choice for those in the semiconductor industry requiring uniform precision on a variety of materials.