Used LAPMASTER 15 #293627114 for sale

LAPMASTER 15 is a fully automated wafer grinding, lapping and polishing equipment that provides superior performance and ultimate accuracy in surface finishing and grinding. It was designed for industrial applications that require high precision and reliability. 15 includes a powerful DC brushless drive motor that allows for smooth, quiet and efficient grinding operations. It can process wafers up to LAPMASTER 15 inches (381 mm) in diameter from 200 to 1000 µm thickness with total accuracy. The system features a differential drive planetary unit which allows for a wide range of grinding and polishing operations. The digital controller allows for precise and repeatable process control, with user-defined parameter settings including feed rates and pressures. 15 uses a high-speed hydro-sphere reservoir to provide a continuous supply of grinding medium. This high-pressure water jet produces a stable grinding environment as well as an optimal process cooling effect. The hydrosphere reservoir also helps reduce poor particle contamination while maintaining uniform process pressure. In addition, LAPMASTER 15 machine features intelligent observer software that provides real-time process monitoring. This monitoring tool allows for tracking of critical process parameters such as grinding pressure, speed and temperature. The observer software can provide insight into performance issues and make recommendations for optimal processes. 15 is designed to deliver time and cost savings with its comprehensive, easy-to-operate and cost-effective design. Its modular design provides flexibility and scalability, allowing it to be adapted to various process requirements and applications. To ensure reliable and repeatable feedback, LAPMASTER 15 includes a range of optical metrology tools, including optical interferometers and profilers. These tools are used to measure and analyze the surface of the polished wafers, providing the user with a comprehensive review of the grinding results. Overall, 15 provides maximum accuracy in wafer grinding and polishing operations, with excellent repeatability and reliable feedback. It is a comprehensive, reliable and cost-effective asset, making it an ideal choice for a wide range of industrial applications.