Used LAPMASTER 15 #293797202 for sale

LAPMASTER 15
ID: 293797202
Polishing machine.
LAPMASTER 15 is a multi-purpose wafer grinding, lapping and polishing equipment designed for processing semiconductor wafers up to 15 inches/380mm in size. This system is a full featured grinding and polishing unit, offering a combination of reliable tools and automation that provide superior performance and accuracy in both abrasive grinding and polishing applications, while minimizing the labor-intensive manual processes required. LAPMASTER 15 features a hardened steel plate bed with adjustable clamping and leveling for precise sample alignment. The wafer is held securely in place with a custom designed sample holder, which can be replaced quickly and easily. A 12 position spindle has been designed with maximum flexibility, allowing polishing and grinding to be performed on both sides of the wafer in either a vertical or horizontal orientation. This spindle is driven by a brushless DC motor, providing smooth, consistent movements that result in a precise and repeatable finish. Flexibility can also be seen in the abrasive grinding/polishing solution offered by 15. Flexible abrasives such as diamond and CBN, as well as traditional polishing compounds, can be used on both sides of the wafer. LAPMASTER 15 ensures uniform and consistent grinding, lapping and polishing results regardless of the abrasive used, ensuring that even the most challenging applications can easily be met. 15 also offers exceptional automation capabilities. An intuitive user interface and advanced process control algorithms help to optimize the grinding/polishing process, and data can be recorded and exported for further analysis. The machine can be fully automated for in-line operation, with the ability to operate with up to 8 wafers at a time. LAPMASTER 15 is a versatile grinding, lapping and polishing tool that offers an excellent combination of accuracy, efficiency and flexibility. With its advanced process control software, intuitive user interface and robust design, it is ideally suited for producing a wide range of semiconductor wafers quickly and effectively.
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