Used LAPMASTER 15 #9124187 for sale

LAPMASTER 15 is a powerful wafer grinding, lapping, and polishing equipment designed for medium-volume production. The system is composed of a computer-controlled workstation and adjustable multi-axis positioning unit to provide flexibility, accuracy, and repeatability. The machine operates in three general stages, cutting, grinding, lapping and polishing. 15 offers cutting capabilities to provide precise wafer shapes and sizes. The advanced diamond-tipped cutting wheel allows for quick, precise cutting with very low levels of micro-fractures and chipping. The grinding wheel, featuring an oscillating orbital pattern and adjustable grinding pressure, can achieve the desired surface roughness and flatness with very low levels of thermal damage. For the Lapping stage of the process, LAPMASTER 15 offers variable speed, variable stroke and variable force options to effectively provide the desired surface conditions for both coarse and fine lapping applications. The integrated abrasive delivery tool meters a controlled uniform abrasive slurry onto the wafer surface allowing for a highly polished finish. The final stage of the wafer polishing process is achieved with the optional polishing wheel. 15's polishing wheel asset achieves a homogenous, mirror-like surface devoid of microscopic scratches or other surface defects due to it's mechatronic control of the wheel contact force, speed, and pressure. LAPMASTER 15 is an incredibly powerful model that offers great versatility, accuracy and repeatability. The equipment provides a cost effective yet high quality surface finishing process to ensure a uniform and highly precise product. 15 is ideal for medium volume production of wafers and is becoming a standard for demanding applications in semiconductors, MEMS and solar cells.